This is the first stable release of the 3.7 firmware line. Headline features are TLS support in standalone mode so that DWC can be served over HTTPS, experimental third-order motion control on the MB6HC, phase stepping and microstep waveform correction for drivers on CAN-connected boards, two-slope pressure advance, triggers on object model expressions using M581.1, and support for the Bondtech INDX tool board including load cell probing.
Duet 2 is no longer supported, HTTP is no longer enabled by default, M408, M301 and M304 have been withdrawn, any attached PanelDue must be upgraded to firmware 3.7.0 or later, and the M575 device numbers have changed because the main boards now provide two USB CDC channels. Please read the upgrade notes at https://github.com/Duet3D/RepRapFirmware/wiki/Changelog-RRF-3.x#reprapfirmware-370 before installing.
Also included in this release are:
- New IAP files (the file that needs to be on the SD card in order to install a main board firmware update). These need to be copied to the SD card, because firmware 3.7 cannot use older IAP files to install further 3.7 series firmware or to downgrade.
- New bootloader files for tool and expansion boards.
For WiFi equipped boards the recommended WiFi firmware version is 2.4.1 available at https://github.com/Duet3D/WiFiSocketServerRTOS/releases/tag/v2.4.1.
Users of Duet in standalone mode may upgrade using the file here. Users of Duet with attached Single Board Computer should upgrade from the package server as usual.